53-77-10G

53-77-10G

Images are for reference only
See Product Specifications

53-77-10G
Описание:
HEATSINK
Упаковка:
Bulk
Datasheet:
53-77-10G Datasheet (PDF)
ECAD-модель:
-
Атрибуты продукта
номер части:53-77-10G
Категория:Fans, Thermal Management
Подкатегория:Thermal - Pads, Sheets
Производитель:Aavid, Thermal Division of Boyd Corporation
Упаковка:Bulk
Product Status:4d3d769b812b6faa6b76e1a8abaece2d
Usage:336d5ebc5436534e61d16e63ddfca327
Type:336d5ebc5436534e61d16e63ddfca327
Shape:336d5ebc5436534e61d16e63ddfca327
Outline:336d5ebc5436534e61d16e63ddfca327
Thickness:336d5ebc5436534e61d16e63ddfca327
Material:336d5ebc5436534e61d16e63ddfca327
Adhesive:336d5ebc5436534e61d16e63ddfca327
Backing, Carrier:336d5ebc5436534e61d16e63ddfca327
Color:336d5ebc5436534e61d16e63ddfca327
Thermal Resistivity:336d5ebc5436534e61d16e63ddfca327
Thermal Conductivity:336d5ebc5436534e61d16e63ddfca327
In Stock: 0
Stock:
0 Can Ship Immediately
  • Делиться:
Для использования с
EYG-E0912XD9D
EYG-E0912XD9D
Panasonic Electronic Components
THERM PAD 115MMX90MM W/ADH GRAY
EYG-R0305ZRSM
EYG-R0305ZRSM
Panasonic Electronic Components
THERM PAD 27X51X0.35MM GRAY
DTT65-320-320-1.5
DTT65-320-320-1.5
Shiu Li Technology Co., Ltd.
THERMAL PAD, SHEET 320X320MM, TH
SF100S-202005
SF100S-202005
CUI Devices
THERMAL INTERFACE MATERIAL, SF10
SP2000-0.015-00-24
SP2000-0.015-00-24
Bergquist
THERM PAD 43.18MMX30.15MM WHITE
A17682-040
A17682-040
Laird Technologies - Thermal Materials
TFLEX UT21000 9" X 9"
2591008
2591008
Bergquist
TGP10000ULM-0.040-02-0808
8-5-8815
8-5-8815
3M (TC)
THERM PAD 4.57MX203.2MM W/ADH
N800B-320-320-3.5
N800B-320-320-3.5
Shiu Li Technology Co., Ltd.
THERMAL PAD, SHEET 320X320MM, TH
LI98-2000-12-0.15
LI98-2000-12-0.15
t-Global Technology
THERM PAD 2MX12MM W/ADH WHITE
T62-15-15-0.13
T62-15-15-0.13
t-Global Technology
THERM PAD 15MMX15MM BLACK
TG-AL375-100-100-0.3-0
TG-AL375-100-100-0.3-0
t-Global Technology
THERM PAD 100MMX100MM GRAY
Вас также может заинтересовать
MAX08NG
MAX08NG
Aavid, Thermal Division of Boyd Corporation
MAX CLIP TO-218/TO-247 SCREW-MNT
CLP-202G
CLP-202G
Aavid, Thermal Division of Boyd Corporation
HEATSINK CLIP
577102B04000G
577102B04000G
Aavid, Thermal Division of Boyd Corporation
HEATSINK TO-220 W/TAB .375"
322605B00000G
322605B00000G
Aavid, Thermal Division of Boyd Corporation
HEATSINK TO-5 1.25W H=.25" BLK
647062
647062
Aavid, Thermal Division of Boyd Corporation
INTEL XEON CPU COOLER 1U
508600B00000G
508600B00000G
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
581002B00000G
581002B00000G
Aavid, Thermal Division of Boyd Corporation
HEATSINK
6271B
6271B
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
E300-70/2-211
E300-70/2-211
Aavid, Thermal Division of Boyd Corporation
EPDM -211 O-RING
E300-70/2-217
E300-70/2-217
Aavid, Thermal Division of Boyd Corporation
EPDM -217 O-RING
43-02-4G
43-02-4G
Aavid, Thermal Division of Boyd Corporation
INSULATOR CIRCULAR 0.002"
7717-156DAPG
7717-156DAPG
Aavid, Thermal Division of Boyd Corporation
MOUNT RECT IC 14DIP 0.050"