Logo Logo
0
Мой запрос предложений
English


TH235-2-30G-4SYR

TH235-2-30G-4SYR

Images are for reference only
See Product Specifications

TH235-2-30G-4SYR
Mfr.:
Описание:
NON SILICONE THERMAL PUTTY
Упаковка:
Tube
Datasheet:
TH235-2-30G-4SYR Datasheet (PDF)
ECAD-модель:
-
Атрибуты продукта
номер части:TH235-2-30G-4SYR
Категория:Fans, Thermal Management
Подкатегория:Thermal - Adhesives, Epoxies, Greases, Pastes
Производитель:Penchem Technologies Sdn Bhd
Упаковка:Tube
Product Status:4d3d769b812b6faa6b76e1a8abaece2d
Type:2b5b555ebe26d4a77c19c59d470d4be1
Size / Dimension:7b15f9f7ebf6f4d30268821300c7d618
Usable Temperature Range:0723794419a575078a2a377eda433c41
Color:9594eec95be70e7b1710f730fdda33d9
Thermal Conductivity:5f894e1b8c8f4a4d63ed9ed8b69ae6fd
Features:336d5ebc5436534e61d16e63ddfca327
Shelf Life:5c1895c4a8d02c1e345d0d0624e1e2b5
Storage/Refrigeration Temperature:336d5ebc5436534e61d16e63ddfca327
In Stock: 4
Stock:
4 Can Ship Immediately
  • Делиться:
Для использования с
TC4-5G
TC4-5G
Chip Quik Inc.
HEAT SINK THERMAL COMPOUND - DEE
65-02-GEL45-0180
65-02-GEL45-0180
Parker Chomerics
THERM-A-GAP GEL45 180CC EFD SYR
8349TFM-50ML
8349TFM-50ML
MG Chemicals
THERMAL ADHESIVE 50ML
1188119
1188119
LOCTITE
STYCAST 2850FT BLK18# 8.16KG
GF3500S35-00-60-400CC
GF3500S35-00-60-400CC
Bergquist
LIQUID GAP FILLER THERMAL CONDUC
100000F00000G
100000F00000G
Aavid, Thermal Division of Boyd Corporation
THERMAL PASTE
1188046
1188046
LOCTITE
CATALYST 24LV CLR 8LB INDIV
A13926-01
A13926-01
Laird Technologies - Thermal Materials
TPUTTY 504 400CC PAIL
TGZ30-300
TGZ30-300
Leader Tech Inc.
300CC
DM-TIM-15025-SYP-10
DM-TIM-15025-SYP-10
Dycotec Materials Ltd
NON-SILICONE THERMAL GEL, 2.5 W/
9E250730CC
9E250730CC
ELBA LUBES
SILICONE HEAT SINK PASTE 30 G
PROHMPROTECT-3800-1.5
PROHMPROTECT-3800-1.5
ProhmTect
ELEC THERM COND PASTE NONSILIC 1
Вас также может заинтересовать
TH235-2-50G-4JAR
TH235-2-50G-4JAR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
TH930-50G-2JAR
TH930-50G-2JAR
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
TH235-2-500G-JAR
TH235-2-500G-JAR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
TH855-5-500G-JAR
TH855-5-500G-JAR
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
TH855-5-50G-2JAR
TH855-5-50G-2JAR
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
TH930-500G-JAR
TH930-500G-JAR
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
TH832-288-192-1.0
TH832-288-192-1.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH832-288-192-1.5
TH832-288-192-1.5
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH997-288-192-5.0
TH997-288-192-5.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH832-288-192-0.5
TH832-288-192-0.5
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH997-288-192-1.0
TH997-288-192-1.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH994-288-192-0.5
TH994-288-192-0.5
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD