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| Производитель, номер детали | запрос цен | Ряд | Упаковка | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - | |
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CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - | |
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Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | ||
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Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - | ||
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Jar | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | ||
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CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - | |
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275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | |
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ULTRAPURE® | Bulk | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1.66 lbs (750g) | - | - | - | |
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SMD | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 3.5 oz (100g) | - | - | - | |
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Jar | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | ||
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SMD3 | Bulk | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 7 oz (200g) | - | - | - | |
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SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 7 oz (200g) | - | - | - | |
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Bag | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.047" (1.19mm) | 440°F (227°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | - | Lead Free | Tube, 0.71 oz (20g) | - | - | - | ||
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SMD | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Tube, 0.4 oz (11.34g) | - | - | - | |
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Super Low Dross™ | Bulk | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - | - | |
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Super Low Dross™ | Bulk | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - | - | |
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Spool | Obsolete | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.047" (1.19mm) | 440°F (227°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - | ||
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Jar | Active | Solder Paste, Two Part Mix | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 0.53 oz (15g) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | ||
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SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - | |
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SUPER-PURE™ | Tube | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | - | No-Clean | 24 AWG, 25 SWG | - | Lead Free | - | - | - | - |