GoodChip

Thermal - Heat Sinks

113301 Предметы

Производитель, номер детали	Ряд	Упаковка	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
960-19-33-F-AB-0 HEATSINK 19X33MM FRONT PUSH PIN Wakefield-Vette	960	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	1.299" (33.00mm)	-	-	-	Aluminum	Black Anodized
APF30-30-06CB HEATSINK LOW-PROFILE FORGED CTS Thermal Management Products	APF	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.250" (6.35mm)	-	4.40°C/W @ 200 LFM	-	Aluminum	Black Anodized
960-19-28-F-AB-0 HEATSINK 19X28MM FRONT PUSH PIN Wakefield-Vette	960	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	1.102" (28.00mm)	-	4.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-CPX045045030-163-C2-R0 HEATSINK 45X45X30MM L-TAB CP Advanced Thermal Solutions Inc.	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	1.772" (45.00mm)	1.772" (45.00mm)	-	1.181" (30.00mm)	-	2.90°C/W @ 100 LFM	-	Aluminum	Blue Anodized
PV-T21-38E DUAL PIN FIN HEATSINK 1 CLIP Ohmite	P	Box	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip and PC Pin	Rectangular, Pin Fins	2.170" (55.12mm)	1.240" (31.50mm)	-	1.520" (38.61mm)	-	-	3.89°C/W	Aluminum	Degreased
960-31-12-S-AB-0 HEATSINK 31X12MM SIDE PUSH PIN Wakefield-Vette	960	Tray	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.220" (31.00mm)	1.220" (31.00mm)	-	0.472" (12.00mm)	-	5.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
OMNI-220-18-25-1C HEATSINK 18X25MM 1-CLIP TO-220 Wakefield-Vette	OmniKlip™	Tray	Active	Board Level, Vertical	TO-220	Clip, Solder Foot	Rectangular, Fins	0.984" (25.00mm)	0.710" (18.03mm)	-	1.500" (38.10mm)	-	-	-	Aluminum	Black Anodized
335824B00034G HEATSINK BGA W/ADHESIVE TAPE Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.180" (29.97mm)	1.180" (29.97mm)	-	0.370" (9.40mm)	2.0W @ 60°C	9.10°C/W @ 200 LFM	29.40°C/W	Aluminum	Black Anodized
505403B00000G HEATSINK TO-3 H31.75MM Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level	TO-3	Bolt On	Square, Pin Fins	1.780" (45.21mm)	1.780" (45.21mm)	-	1.250" (31.75mm)	7.0W @ 40°C	1.50°C/W @ 600 LFM	6.00°C/W	Aluminum	Black Anodized
APR27-27-12CB/A01 HEATSINK FORGED W/THERMAL TAPE CTS Thermal Management Products	APR	Box	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.047" (26.60mm)	1.047" (26.60mm)	-	0.457" (11.60mm)	-	5.30°C/W @ 200 LFM	-	Aluminum	Black Anodized
501603B00000G HEAT SINK TO-3 1.25" COMPACT Aavid, Thermal Division of Boyd Corporation		Tray	Active	Board Level	TO-3	Bolt On	Rhombus	1.880" (47.75mm)	1.400" (35.56mm)	-	1.250" (31.75mm)	4.0W @ 30°C	3.00°C/W @ 200 LFM	7.80°C/W	Aluminum	Black Anodized
374724B60024G HEATSINK BGA W/O SOLDER ANCHORS Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Top Mount	BGA	Solder Anchor	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.709" (18.00mm)	3.0W @ 50°C	5.20°C/W @ 200 LFM	15.30°C/W	Aluminum	Black Anodized
ATS-06C-152-C2-R0 HEATSINK 35X35X35MM L-TAB T766 Advanced Thermal Solutions Inc.	pushPIN™	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	1.378" (35.00mm)	-	3.32°C/W @ 100 LFM	-	Aluminum	Blue Anodized
OMNI-UNI-30-75-D HEATSINK TO-247 TO-264 TO-220 Wakefield-Vette	OmniKlip™	Bulk	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	2.953" (75.00mm)	1.181" (30.00mm)	-	2.362" (60.00mm)	-	-	-	Aluminum	Black Anodized
901-19-1-23-2-B-0 HEATSINK 19X19X23MM ELLIPTICAL Wakefield-Vette	901	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.892" (22.65mm)	-	4.90°C/W @ 200 LFM	12.00°C/W	Aluminum	Black Anodized
PF750G HTSK-AL-PF750 REV A-G Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular	0.866" (22.00mm)	0.433" (11.00mm)	-	0.748" (19.00mm)	-	-	-	Aluminum	Tin
6221BG THM,16555B REV D-G Aavid, Thermal Division of Boyd Corporation		Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	-	-	-	Aluminum	Black Anodized
CE-OMNI-38 HEATSINK CER TO-220 TO-247 Wakefield-Vette		Tray	Active	Board Level, Vertical	TO-220, TO-247	Solderable Feet	Rectangular, Fins	0.803" (20.40mm)	1.339" (34.00mm)	-	1.512" (38.40mm)	-	3.80°C/W @ 200 LFM	7.00°C/W	Ceramic	-
OMNI-UNI-40-50-D HEATSINK TO-247 TO-264 TO-220 Wakefield-Vette	OmniKlip™	Bulk	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	1.969" (50.00mm)	1.575" (40.00mm)	-	2.953" (75.00mm)	-	-	-	Aluminum	Black Anodized
609-50ABS3 HEATSINK FOR POWERPC CPU BLK Wakefield-Vette	609	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Clip, Thermal Material	Rectangular, Pin Fins	2.895" (73.53mm)	2.000" (50.80mm)	-	0.500" (12.70mm)	-	2.50°C/W @ 250 LFM	-	Aluminum	Black Anodized