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TH235-2-500G-JAR

TH235-2-500G-JAR

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TH235-2-500G-JAR
Mfr.:
Описание:
NON SILICONE THERMAL PUTTY
Упаковка:
Bottle
Datasheet:
TH235-2-500G-JAR Datasheet (PDF)
ECAD-модель:
-
Атрибуты продукта
номер части:TH235-2-500G-JAR
Категория:Fans, Thermal Management
Подкатегория:Thermal - Adhesives, Epoxies, Greases, Pastes
Производитель:Penchem Technologies Sdn Bhd
Упаковка:Bottle
Product Status:4d3d769b812b6faa6b76e1a8abaece2d
Type:2b5b555ebe26d4a77c19c59d470d4be1
Size / Dimension:3f13d88111fcda0d0dacec3dfc043d6f
Usable Temperature Range:0723794419a575078a2a377eda433c41
Color:9594eec95be70e7b1710f730fdda33d9
Thermal Conductivity:5f894e1b8c8f4a4d63ed9ed8b69ae6fd
Features:336d5ebc5436534e61d16e63ddfca327
Shelf Life:5c1895c4a8d02c1e345d0d0624e1e2b5
Storage/Refrigeration Temperature:336d5ebc5436534e61d16e63ddfca327
In Stock: 10
Stock:
10 Can Ship Immediately
  • Делиться:
Для использования с
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