TH997-288-192-2.0

TH997-288-192-2.0

Images are for reference only
See Product Specifications

TH997-288-192-2.0
Описание:
SOFT SILICONE THERMAL PAD
Упаковка:
Sheet
Datasheet:
TH997-288-192-2.0 Datasheet (PDF)
ECAD-модель:
-
Атрибуты продукта
номер части:TH997-288-192-2.0
Категория:Fans, Thermal Management
Подкатегория:Thermal - Pads, Sheets
Производитель:Penchem Technologies Sdn Bhd
Упаковка:Sheet
Product Status:4d3d769b812b6faa6b76e1a8abaece2d
Usage:d35811a07ccaafd65528c082c55b3578
Type:749eba2f14c207fae1481c688970fbaa
Shape:7545c5d3ad246a683a197a2903a4d5e6
Outline:e86026443365955e62b0a844cea00ca8
Thickness:575494299d2bc2109f35426ca82fe099
Material:ec441627d2bb5418ead520e540bdab02
Adhesive:53c455233d0789ba256d01674b704190
Backing, Carrier:336d5ebc5436534e61d16e63ddfca327
Color:9594eec95be70e7b1710f730fdda33d9
Thermal Resistivity:336d5ebc5436534e61d16e63ddfca327
Thermal Conductivity:9fbc9be199c3036a998660e9703c7d3a
In Stock: 0
Stock:
0 Can Ship Immediately
  • Делиться:
Для использования с
60-12-5791-1674
60-12-5791-1674
Parker Chomerics
CHO-THERM 1674 TO-220 0.010" ADH
1/2-5-8805
1/2-5-8805
3M (TC)
THERM PAD 4.57MX12.7MM WHT
A17713-08
A17713-08
Laird Technologies - Thermal Materials
THERM PAD 228.6MMX228.6MM BLUE
A17747-18
A17747-18
Laird Technologies - Thermal Materials
TFLEX P3180 9.00X9.00IN
SP2000-0.020-00-1212
SP2000-0.020-00-1212
Bergquist
THERM PAD 304.8MMX304.8MM WHITE
SF500-153005
SF500-153005
CUI Devices
THERMAL INTERFACE MATERIAL, SF50
N700A-320-320-0.5
N700A-320-320-0.5
Shiu Li Technology Co., Ltd.
THERMAL PAD, SHEET 320X320MM, TH
A18171-16
A18171-16
Laird Technologies - Thermal Materials
TPCM 7400 18X18IN
A18171-05
A18171-05
Laird Technologies - Thermal Materials
TPCM 7125 18X18IN
A18444-09
A18444-09
Laird Technologies - Thermal Materials
TFLEX HD7.5,2.25 9X9IN,
TG-APC94-320-320-3.0-0
TG-APC94-320-320-3.0-0
t-Global Technology
THERM PAD 320MMX320MM RED
TG-AH482-55.9-15.25-2.0-1A
TG-AH482-55.9-15.25-2.0-1A
t-Global Technology
THERMAL PAD
Вас также может заинтересовать
TH235-2-50G-4JAR
TH235-2-50G-4JAR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
TH930-50G-2JAR
TH930-50G-2JAR
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
TH235-2-500G-JAR
TH235-2-500G-JAR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
TH855-5-50G-4JAR
TH855-5-50G-4JAR
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
TH235-2-30G-4SYR
TH235-2-30G-4SYR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
TH855-5-30G-2SYR
TH855-5-30G-2SYR
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
TH994-288-192-3.0
TH994-288-192-3.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH997-288-192-1.0
TH997-288-192-1.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH997-288-192-3.0
TH997-288-192-3.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH994-288-192-1.0
TH994-288-192-1.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH832-288-192-2.5
TH832-288-192-2.5
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
TH994-288-192-2.5
TH994-288-192-2.5
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD